- Lead Free Production: In order to comply with the laws in Japan, Europe and various other countries, lead free production was launched in 2002, such as solder paste, IC component, R.C. Chip.
- SMT of Ball Grid Array Components: SMT and maintenance technologies of BGA and QFN products
- SMT of 0201 Components: Mass production of 0204 type components is launched in 2001, while the smallest 0201 components in SMT production was launched in 2004, leading the industry in SMT production and research.
- High-speed Machine Placement Capability: 0.06s/Chip(0201) 60,000 cph
- QFP / pitch 0.4mm
- Micro BGA
- Connector / pitch 0.4mm
Cashido has six fully-automated SMT production lines, pure water rinsing equipment, AOI automated inspection equipment, X-Ray, MES manufacturing executive system, automatic SPI 3D silicone paste testing equipment and other necessary SMT equipment. This professional SMT equipment will fulfill our customer’s production needs.
ΩMES Manufacturing Executive System
The moment the order is received, the products are put into production. To prevent using the wrong materials, all information on production line products is instantly collected and saved into a report.
- Corporate Module
- Equipment Module
- Material Module
- Area Module
- Quality Control Module
- Operation Station Module
- Process Module
- Product Module
1.In Production Management
♣ Fully Automated Silicon Paste Printer
Maximum PCB Dim.：650＊550mm
PCB SIZE ：Max 460mm＊460mm ~Min 80mm＊ 50 mm
Printing Accuracy：± 12.5 μm / 6σ
♣ SPI 3D Silicon Paste Testing Equipment
PCB SIZE : 50mm * 50mm(Min)~510mm*460mm(Max)
PCB Thickness : 0.4mm~7.0mm
♣ SMT Fully Automated High Speed Printer
Mount speed:0.066 s/Chip(0201)
Position accuracy:50um/3σ with Vision inspecting
♣ Reflow Oven
8-zone independent air circulation
PCB SIZE：50mm ~ 457mm
Temperature control range ：80 ~ 350 ℃
♣ Water Washing Equipment
SMT components and PCB surfaces are washed, both sides of the board are cleaned.
♣ AOI Automated Visual Inspection
Automated inspection of SMT components, confirming the components have been melded to the board.
♣ X-Ray Visual Inspection
Non-destructive X-Rays are used in inspection to confirm the IC, QFN and BGA are welded properly.
♣ Router Cutter
PCB SIZE MAX：285mm*340mm
X – Y cutting speed：0~100mm/s
Cutting accuracy： ± 0.1
Turning speed：Max 40000rpm
♣ ESD Anti-Static Protection