In order to comply with the laws in Japan, Europe and various other countries, lead free production was launched in 2002, such as solder paste, IC component, R.C. Chip.
SMT of Ball Grid Array Components
SMT of 0201 Components
SMT and maintenance technologies of BGA and QFN products
SMT of 0201 Components
SMT of 0201 Components
Mass production of 0204 type components is launched in 2001, while the smallest 0201 components in SMT production was launched in 2004, leading the industry in SMT production and research.
